| ・ |
Contacts both sides (double side) of wafer |
| ・ |
Effective position compensation for the warpage of wafer |
| ・ |
Successful record 100% of Alignment for customers' products (Record only in Japan) |
| ・ |
Measures the accurate RDS (on-resistance) |
| ・ |
Probing at more than two points by moving in a chip (Micro Probing) |
| ・ |
Large current/High voltage probing is supported by the wafer clamp system
with ceramic blade |
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Low noise: More than -80dB on the chuck
(Reference Value: 30KHZ to 30MHZ Loop ANT actual measurement) |
| ・ |
High rigidity cabinet made by the iron surface plate and the welding frame
realizes low vibration |
| ・ |
Low cost and High throughput |
| ・ |
Small space (Footprint), power-saving design |
| ・ |
Stable operation (more than MTBF5000 hours) |