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Contacts both sides (double side) of wafer |
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Effective position compensation for the warpage of wafer |
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Successful record 100% of Alignment for customers' products (Record only in Japan) |
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Measures the accurate RDS (on-resistance) |
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Probing at more than two points by moving in a chip (Micro Probing) |
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Large current/High voltage probing is supported by the wafer clamp system
with ceramic blade |
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Low noise: More than -80dB on the chuck
(Reference Value: 30KHZ to 30MHZ Loop ANT actual measurement) |
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High rigidity cabinet made by the iron surface plate and the welding frame
realizes low vibration |
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Low cost and High throughput |
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Small space (Footprint), power-saving design |
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Stable operation (more than MTBF5000 hours) |