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PCP Series is a series of probers designed to measure thin wafers, diced wafers and special shape substrates in addition to general wafers.
PCP Series are designed to transfer a general wafer or a film frame with special shape substrates from the cassette automatically, and perform pre-alignment, fine alignment and probing. |
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Wafer Size:100mm (4 inch) to 200mm (8 inch) |
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Film Frame:300mm (12 inch) or smaller |
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Linear motor stage offers low noise, low magnetic field, and foot print
less than 1 meter square feet. |
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Controlling the stage by chip position data of a wafer. (XY position compensation) |
Solves accumulate errors of contact caused by stage index, initial setting,
and temperature.
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High accurate probing for diced wafer. |
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Able to probe even in a test area of small unit such as WLCSP and QFN which used to be probed by a conventional Handler. |
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Multi-probing inspection dramatically improves a throughput of probing
process. |
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| Examples of System Configuration |
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Tester interface and docking |
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Test system configuration with a general measurement tool |
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Interface with a laser marking |
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