| Nov.10, 2025 |
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SEMICON Japan 2025 |
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We will participate in "SEMICON Japan 2025".
Based on the technology and achievements we have developed so far, we will continue to respond to the trust of customers.
Our unique XY compensation technology and diversified alignment methods provide efficient and high-precision probing.
The PCP Series can inspect not only diced wafers but also electronic components（MLCC, thin film resistors, etc.) arranged on the film frame.
When you come to the venue, please stop by our booth.
【Products】
・Probing handler
・Wafer probers
・Wafer laser marking system
・Measurement system
Date: Dec. 17 to Dec. 19, 2025
Venue: Tokyo Big Sight (East Hall 4)
Booth No. E4729
Visitors are required to register in advance.
Please register from the following site.
https://www.semiconjapan.org/en/about/pricing-and-register |
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