| Wafer Laser Marking System |
| PCP-LM8 |
 ＜Option Feature＞ Great Improvement in Takt by SLM Mode |
SLM (Stored Layout Marking) is the new data processing mode we developed
to improve Takt.
This mode uses the built-in memory in laser controller to speed up the marking process. (※1)
Takt improvement can be expected by approx. 30%(※2) compared to PCP-LM8
standard mode and 50% (※2) compared to PCP-105LM.
※1 Condition: Scaling OFF and matrix marking mode (same marking in the Lot).
※2 According to our research: Takt will change depending on the number of wafers in the Lot, marking condition, prober settings, etc. |
| Clear Color and Damage-free by UV Wavelength |
Compared to the fundamental wavelength (1,064 nm), the UV wavelength (355
nm) has a much higher absorption rate into the material, and highly visible
marking is possible.
Since heat stress is not applied to the product, damage can be reduced. |
| Sample A（Device without BG） |
・Font size
・Solid circle
・Letter
spacing
・Print depth |
：
：
：
： |
0.3mm×0.15mm
φ0.3mm
0.05mm
2.2μm |
 |
・Font size
・Solid circle
・Letter
spacing |
：
：
：
|
0.3mm×0.15mm
φ0.3mm
0.05mm
|
 |
| Fine Marking with Very Small Spot |
| Since the UV wavelength (355 nm) is 1/3 of the fundamental wavelength (1,064
nm), the spot size can be narrowed down by that extent, and it is possible
to print in extremely small letters in a limited space. |
| Print at Smallest Printable Size |
・Font size
・Solid circle
・Letter
spacing
・Print depth |
：
：
：
： |
0.08mm×0.08mm
φ0.08mm
0.05mm
2.6μm |
 |
| Print 36 Alphanumeric Characters at 0.1mm Square |
・Font size
・Letter
spacing
・Print depth |
：
：
：
|
0.1mm×0.1mm
0.05mm
1.6μm
|
 |
The sample marking function can mark a matrix form sample changed from the marking parameters.
Different marking parameters can be assigned for the vertical and horizontal axes of matrix.
| 【Example】 |
[Vertical axis] Laser power 20% to 80% |
|
[Horizontal axis] Scan speed 200mm/s to 500mm/s |
By evaluating the sample marking results marked by changing the marking
parameters in stages, the optimal combination of marking conditions can
be found in a short time. |
| Predictive Maintenance Function |
Power Monitor is equipped standard in Laser Head.
It realize the management of "Laser Power" that is most important for a laser equipment easily and reliably. |
The functions mounted on the prober are inherited from the previous model
(PCP-105LM).
Ensures stable productivity. |
・Supports 6-inch wafer and 8-inch wafer
・Original wafer chucking method
・High-precision alignment
・Split marking, individual marking |
|
