| Wafer Laser Marking System |
| PCP-LM8 |
| Clear Color and Damage-free by UV Wavelength |
Compared to the fundamental wavelength (1,064 nm), the UV wavelength (355
nm) has a much higher absorption rate into the material, and highly visible
marking is possible.
Since heat stress is not applied to the product, damage can be reduced. |
| Sample A（Device without BG） |
・Font size
・Solid circle
・Letter
spacing
・Print depth |
：
：
：
： |
0.3mm×0.15mm
φ0.3mm
0.05mm
2.2μm |
 |
・Font size
・Solid circle
・Letter
spacing |
：
：
：
|
0.3mm×0.15mm
φ0.3mm
0.05mm
|
 |
| Fine Marking with Very Small Spot |
| Since the UV wavelength (355 nm) is 1/3 of the fundamental wavelength (1,064
nm), the spot size can be narrowed down by that extent, and it is possible
to print in extremely small letters in a limited space. |
| Print at Smallest Printable Size |
・Font size
・Solid circle
・Letter
spacing
・Print depth |
：
：
：
： |
0.08mm×0.08mm
φ0.08mm
0.05mm
2.6μm |
 |
| Print 36 Alphanumeric Characters at 0.1mm Square |
・Font size
・Letter
spacing
・Print depth |
：
：
：
|
0.1mm×0.1mm
0.05mm
1.6μm
|
 |
The software automatically extracts the marking conditions if you just select the material.
You can quickly find the optimum conditions from the marking result list.
Marking condition settings which normally require experience can be completed easily in a short time. |
| Predictive Maintenance Function |
Power Monitor is equipped standard in Laser Head.
It realize the management of "Laser Power" that is most important for a laser equipment easily and reliably. |
The functions mounted on the prober are inherited from the previous model
(PCP-105LM).
Ensures stable productivity. |
・Supports 6-inch wafer and 8-inch wafer
・Original wafer chucking method
・High-precision alignment
・Split marking, individual marking |
|
