Top Products Wafer Laser Marking System PCP-LM8

Wafer Laser Marking System
PCP-LM8




Clear Color and Damage-free by UV Wavelength

Compared to the fundamental wavelength (1,064 nm), the UV wavelength (355 nm) has a much higher absorption rate into the material, and highly visible marking is possible.
Since heat stress is not applied to the product, damage can be reduced.

Sample A(Device without BG)
・Font size
・Solid circle
・Letter
 spacing
・Print depth




0.3mm×0.15mm
φ0.3mm
0.05mm

2.2μm

Sample B(Device with BG)
・Font size
・Solid circle
・Letter
 spacing




0.3mm×0.15mm
φ0.3mm
0.05mm



Fine Marking with Very Small Spot

Since the UV wavelength (355 nm) is 1/3 of the fundamental wavelength (1,064 nm), the spot size can be narrowed down by that extent, and it is possible to print in extremely small letters in a limited space.

Print at Smallest Printable Size
・Font size
・Solid circle
・Letter
 spacing
・Print depth




0.08mm×0.08mm
φ0.08mm
0.05mm

2.6μm

Print 36 Alphanumeric Characters at 0.1mm Square
・Font size
・Letter
 spacing
・Print depth




0.1mm×0.1mm
0.05mm

1.6μm


Sample Marking Function

The software automatically extracts the marking conditions if you just select the material.
You can quickly find the optimum conditions from the marking result list.
Marking condition settings which normally require experience can be completed easily in a short time.




Predictive Maintenance Function

Power Monitor is equipped standard in Laser Head.
It realize the management of "Laser Power" that is most important for a laser equipment easily and reliably.


Operability

The functions mounted on the prober are inherited from the previous model (PCP-105LM).
Ensures stable productivity.

・Supports 6-inch wafer and 8-inch wafer
・Original wafer chucking method
・High-precision alignment
・Split marking, individual marking

 製品情報
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