The best Probing Solution for a diced 200mm wafer on the film frame.
For WLCSP and strip form devices such as BGA & QFN etc. |
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| PCP-303N evolved PCP-303SL further. Innovative 300mm probing solution of
diced wafer on the film frame. For WLCSP and strip form devices such as
BGA-QFN etc. |
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