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| 【A】 |
| ● |
AA (Auto Alignment) |
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Function to search for patterns on a wafer, detect wafer position and angle,
rotate chuck, and set the pattern array on a wafer parallel to the XY stage
automatically by using the alignment camera. |
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| ● |
Alignment |
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Align the position of wafer.
In our PCP series, it is a function to adjust θ and to detect First Die. |
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| ● |
APA (Auto Probe to Pad Alignment) |
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Function to detect probe position and height by using APA camera. |
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| ● |
AWP (Auto Wafer Profiler) |
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Function to detect wafer thickness by using AWP camera. |
| 【B】 |
| ● |
BCR (Bar Code Reader) |
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Barcode Reader |
| 【C】 |
| ● |
Cantilever Type Probe |
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Probe pin that has a terminal structure to work in a cantilever structure. |
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| ● |
Chip (Size) |
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A single device diced from a wafer. (Size) |
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| ● |
Chuck |
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The wafer chuck fixes a wafer or tape frame (film frame) by vacuum adsorption while probing.
High flatness is required to make probe pins contact evenly.
Some wafer chuck can adjust the surface temperature to low or high. |
| 【D】 |
| ● |
Die Size Scaling |
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A function that actually measures the die position at a certain distance on a wafer and determines the die size based on it. |
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| ● |
Double Sided Wafer Prober |
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Wafer prober that contacts both sides of wafer
Wafer prober to test the devices that have electrode pads on the front and back of wafer, such as power devices. |
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| ● |
DUT (Device Under Test) |
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Device to be tested. |
|
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| ● |
DUT Board (Device Under Test Board) |
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A board to relay the signals required for inspection between DUT and the
test head. |
| 【F】 |
| ● |
Fine Alignment |
|
A function to perform Alignment by image processing using the die pattern
on the wafer. |
|
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| ● |
First Die |
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The reference die which is referred when making various settings on a wafer. |
|
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| ● |
Full Automatic Probe System |
|
The probing system that loads wafers, sequentially contacts the needles
of the probe card to the pad of each die, and automatically performs all
test inspections to see if the electrical characteristics of the device
pass in cooperation with the tester and the measuring instruments. |
| 【H】 |
| ● |
Hot Chuck |
|
A wafer chuck that can control the surface temperature, especially a chuck
that can set from room temperature to high temperature range. |
| 【I】 |
| ● |
IDM (Integrated Device Manufacturer) |
|
A device manufacturer which consistently performs all manufacturing processes from the front-end to the back-end of semiconductor manufacturing. |
|
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| ● |
Index (Index Size) |
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The distance of same pattern repeated in the X/Y direction on a wafer to be tested.
Also, it is the distance to travel in a single measurement. |
|
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| ● |
Index Time |
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The time after having completed the test of one die or device until the positioning of next die or device is completed and it can start testing, when performing the probing continuously.
This is one of the elements that affect the reduction of test time. |
|
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| ● |
Indexer |
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The mechanism that aligns the heights of the slot in the cassette and the
transfer arm when transporting a wafer or tape frame (film frame). |
|
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| ● |
Inking |
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To mark a chip judged as defective in inspection with special ink. |
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| ● |
Ionizer |
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Voltage-applied static electricity remover |
| 【L】 |
| ● |
Laser Marking System |
|
A system that engraves letters such as ID and bar code with a laser on
the back of the wafer chip. |
| 【M】 |
| ● |
Magnet Plate |
|
A jig corresponding to the magnet plate of positioner when probing with
a positioner. |
|
|
| ● |
Manipulator |
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Mechanism that has the test head, and connects or disconnects to/from a
wafer prober or a probing handler. |
|
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| ● |
MEMS Type Probe Tip |
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Probes made by using MEMS technology. (MEMS: micro electro-mechanical system) |
|
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| ● |
Micro Positioner |
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A mechanism for positioning probes equipped with a 3-axis stage mechanism. |
|
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| ● |
Micro Probing |
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To move to multiple pad positions called micro-sites in a single die and
perform probing. |
|
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| ● |
Multi-die Probing |
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To perform probing and measurement of multiple dice simultaneously in one
index. |
|
|
| ● |
Multi-Die Test , Simul-Test Multi-site Test |
|
To test multiple chips simultaneously to improve the test throughput. |
| 【N】 |
| ● |
Needle Cleaning |
|
Mechanism that removes foreign matter and polishes the needle tips of probes, by using the cleaning unit installed in the probing system. |
|
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| ● |
Non-magnetic Specifications |
|
The specifications in which the materials of the metal etc. have been changed
so that the magnetic field does not affect the measurement when testing
the Hall elements and magnetic sensors. |
| 【O】 |
| ● |
Offline Editor |
|
The software to edit test area etc. by a PC other than the probing system. |
|
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| ● |
OST (Outsourced Semiconductor Assembly & Test) |
|
A manufacturing form which undertakes inspection and assembly of post-processes
from electronic component manufacturers. |
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| ● |
Over Travel |
|
After probes contact pads of the wafer, they is pushed further in to make hard contact.
It is sometimes referred to as "overdrive". |
| 【P】 |
| ● |
Performance Board |
|
One of the boards that transmits the signals necessary for the test between
the probe card and the test head, when inspecting wafers and chips. |
|
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| ● |
Pre-alignment |
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A function to center a wafer and adjust the loading angle at the transfer unit. |
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| ● |
Probe (Probe Pin) |
|
A contactor for contacting a wafer pad to test electrical characteristics
when testing a device chip. There are several types of probes, such as
cantilever, spring pins, MEMS pins, crowns, needles. |
|
|
| ● |
Probe Card |
|
A jig to test by contacting probe pins to pads formed on chips on a wafer or frame to input and output electrical signals.
The structure of probe card consists of a printed wiring board and probe pins attached thereto, and there are various forms and structures to be installed in the probing systems. |
|
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| ● |
Probe Mark |
|
Marks left on the electrode pads on a wafer by probing operation. The shape varies according to the pad film material, film thickness, overdrive distance, the number of contacts, etc. |
|
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| ● |
Probing Handler |
|
The equipment that automatically contacts the probes to the diced chips on a tape frame sequentially and performs inspection, working with a tester and measuring instruments.
It is important to be able to perform Alignment of the probe position accurately even for the position deviated chips after dicing. |
| 【Q】 |
| ● |
Quick Loader |
|
The mechanism to make the next wafer wait near the chuck delivery position inside the transfer unit in order to shorten the transport time.
By shortening the load time, it is effective in shortening the takt time of multiple wafers. |
| 【R】 |
| ● |
Ring Carrier |
|
The plate to install a probe card and camera. When docking a test head, performance board, etc., the ring carrier is the position to attach them. |
| 【S】 |
| ● |
Spring Contact Pins |
|
Probe pin with the structure to expand/contract the tip of metal pin with
a spring. |
| 【T】 |
| ● |
Tape Frame |
|
This is a frame with film (tape) to fix a wafer, which is used when dicing.
Tape frame is also called as "dicing frame", "film frame", and it is written as "film frame" in our manuals. |
|
|
| ● |
TEG (Test Element Group) |
|
Test patterns on a wafer which are for evaluation and management of process and device. |
|
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| ● |
Temperature Control |
|
A function that the probing system controls the temperature of wafer chuck to control the temperature environment of device while performing the test.
The heater is used when the temperature is higher than room temperature, and a chiller unit is used when the temperature is lower than room temperature, and a heater and chiller etc. may be used in combination depending on the temperature range. |
|
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| ● |
Test Head |
|
A module of mechanism that consists of a section to output the power supply
and test signal applied from tester to device, and a section to receive
the output (reply) from the tested device, and it is connected with the
probing system. |
|
|
| ● |
Tester (ATE: Automated Test Equipment) |
|
An automatic inspection equipment that tests the electrical properties
of semiconductors, electronic components, etc. |
|
|
| ● |
Tester I/F |
|
Interface for communication between the probing system and the tester. |
| 【W】 |
| ● |
Wafer Test |
|
Here, this is the process to perform probing to a wafer, that has completed Front-end process, and to measure electrical characteristics and to judge Good/Bad. This process is to reduce waste in the Back-end process and to provide feedback to the front-end process to improve quality. |
| 【X】 |
| ● |
XY Position Compensation |
|
A function to correct the relative position deviation of individual chips
that occurred in wafer chips after dicing, electronic components, wafers
after heat processing, etc. and to perform accurate probing. |
| 【Z】 |
| ● |
Z Profile |
|
A function to optimize contacts based on the thickness and unevenness information of wafer when probing a wafer surface. |
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