| PRODUCT NAME |
PCP-102SL |
PCP-102WS |
PCP-302N |
| PRODUCT IMAGE |
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| FEATURES |
Development
concept |
Prober designed for a wafer aiming at Low cost and high throughput |
Prober designed to test a double-sided wafer |
Prober designed aiming to flexibly satisfy the customers' demands |
Image
Processing |
XY Compensation (PFC original method) and Profiling compensate the position
even if a wafer is expanded by the temperature. |
XY Compensation (PFC original method) and Profiling compensate the position
even for a warped wafer. |
XY Compensation (PFC original method) and Profiling compensate the position
even if a wafer is expanded by the temperature. |
| Record of Alignment success for customers' products is 100%. (In Japan) |
| Probing |
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) |
Accurate RDS(on-resistance) is measured by making Kelvin connection at
the drain side on the back of wafer and adjusting its drain-sense-position
to the source-sense-position. |
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) |
Capable of Multi-TEG (more than 2 different kinds on a wafer), etc.
by probing in a chip (Micro Probing). |
|
Transfer
section |
Large diameter Pre-alignment chuck can handle a warped wafer,
thin wafer and TAIKO™ Wafer.（OP) |
|
| Quick Loader can reduce the Load/Unload time per sheet to half. (OP) |
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Quick Loader can reduce the Load/Unload time per sheet to half. (OP) |
| Chuck |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
Large current/High voltage probing is supported by the wafer clamp system
with the ceramic blade. |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
| Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control
25℃±0.3℃. (OP) |
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Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP) |
| Noise |
Surface of the chuck: More than－80db (*1) |
Low
Vibration |
High rigidity cabinet made by the iron surface plate and the welding frame |
| Non-magnetic |
Non-magnetic spec is available for a magnetic device. (OP)(*2) |
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Non-magnetic spec is available for a magnetic device. (OP)(*2) |
| Common |
・Low cost, high throughput
・Small space (footprint), power-saving design
・Stable operation (more than MTBF5000 hours) |
|
|
| SPEC |
Wafer Size |
100mm (4 inch) to 200mm (8 inch) |
200mm (8 inch)
to
300mm (12 inch) |
| Probing Area |
Wafer：φ200mm |
Wafer：φ300mm |
| XY Stage |
Driven by linear motor (Repeat accuracy：1um) |
| Foot Print |
Small space：
(W) 1200mm × (D) 860mm |
Small space：
(W) 1615mm
×
(D) 1000mm |
|
| OTHERS |
・Total： PCP series more than 430 sets (As of April 2018)
・We can respond to your request flexibly.
・We can offer special price for the purchase of several sets together. |
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