Top Products Wafer Prober Comparing Wafer Prober products
 Products
PRODUCT NAME PCP-102SL PCP-102WS PCP-302N
PRODUCT IMAGE
FEATURES Development
concept
Prober designed for a wafer aiming at Low cost and high throughput  Prober designed to test a double-sided wafer Prober designed aiming to flexibly satisfy the customers' demands
Image
Processing
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature. XY Compensation (PFC original method) and Profiling compensate the position even for a warped wafer. XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature.
Record of Alignment success for customers' products is 100%. (In Japan)
Probing Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) Accurate RDS(on-resistance) is measured by making Kelvin connection at the drain side on the back of wafer and adjusting its drain-sense-position to the source-sense-position. Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP)
Capable of Multi-TEG (more than 2 different kinds on a wafer), etc.
by probing in a chip (Micro Probing).
Transfer
section
Large diameter Pre-alignment chuck can handle a warped wafer,
thin wafer and TAIKO™ Wafer.(OP)
Quick Loader can reduce the Load/Unload time per sheet to half. (OP) ―  Quick Loader can reduce the Load/Unload time per sheet to half. (OP)
Chuck Surface finish for your usage, such as gold plate, nickel plate, etc. Large current/High voltage probing is supported by the wafer clamp system with the ceramic blade. Surface finish for your usage, such as gold plate, nickel plate, etc.
Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP) Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP)
 Noise Surface of the chuck: More than-80db (*1)
 Low
Vibration
High rigidity cabinet made by the iron surface plate and the welding frame
Non-magnetic Non-magnetic spec is available for a magnetic device. (OP)(*2) Non-magnetic spec is available for a magnetic device. (OP)(*2)
Common
・Low cost, high throughput
・Small space (footprint), power-saving design
・Stable operation (more than MTBF5000 hours)
SPEC Wafer Size 100mm (4 inch) to 200mm (8 inch) 200mm (8 inch)
to
300mm (12 inch)
Probing Area Wafer:φ200mm Wafer:φ300mm
XY Stage Driven by linear motor (Repeat accuracy:1um)
Foot Print Small space:
(W) 1200mm × (D) 860mm
Small space:
(W) 1615mm
×
(D) 1000mm
OTHERS
・Total: PCP series more than 430 sets (As of April 2018)
・We can respond to your request flexibly.
・We can offer special price for the purchase of several sets together.

*1 Reference value: 30KHz to 30MHz Loop ANT measurement
*2 Reference value (standard system):Chuck surface: 0.04mT, Transporting rout: 0.2mT

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