| PRODUCT NAME |
PCP-102SL |
PCP-102NT |
PCP-102WS |
PCP-302N |
PCP-302NT |
| PRODUCT IMAGE |
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| Development concept |
Prober designed for a wafer aiming at Low cost and high throughput |
Prober designed for wafer probing, aiming at the low cost and high throughput |
Prober designed to test a double-sided wafer |
Prober designed aiming to flexibly satisfy the customers' demands |
Prober designed for wafer probing, aiming at the low cost and high throughput |
| Image Processing |
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature. |
XY Compensation (PFC original method) and Profiling compensate the position
even if a wafer is expanded by the temperature. |
XY Compensation (PFC original method) and Profiling compensate the position
even for a warped wafer. |
XY Compensation (PFC original method) and Profiling compensate the position
even if a wafer is expanded by the temperature. |
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature. |
| Record of Alignment success for customers' products is 100%. (In Japan) |
| Probing |
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) |
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Accurate RDS(on-resistance) is measured by making Kelvin connection at
the drain side on the back of wafer and adjusting its drain-sense-position
to the source-sense-position. |
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) |
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| Capable of Multi-TEG (more than 2 different kinds on a wafer), etc. by
probing in a chip (Micro Probing). |
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| Transfer section |
| Large diameter Pre-alignment chuck can handle a warped wafer, thin wafer
and TAIKO™ Wafer.（OP) |
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| Transfer section |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
Large current/High voltage probing is supported by the wafer clamp system
with the ceramic blade. |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
| Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control
25℃±0.3℃. (OP) |
Supports Low/High temperature range from -50℃ to 180℃ |
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Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP) |
Supports Low/High temperature range from -50℃ to 180℃ |
| Noise |
Surface of the chuck: More than－80db (*1) |
| Low Vibration |
High rigidity cabinet made by the iron surface plate and the welding frame |
| Non-magnetic |
Non-magnetic spec is available for a magnetic device. (OP)(*2) |
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Non-magnetic spec is available for a magnetic device. (OP)(*2) |
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| Common |
・Low cost, high throughput
・Small space (footprint), power-saving design
・Stable operation (more than MTBF5000 hours) |
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| Wafer Size |
4 inch to 8 inch |
8 inch to 12 inch |
| Probing Area |
Wafer：φ200mm |
Wafer：φ300mm |
| XY Stage |
Driven by linear motor (Repeat accuracy：1um) |
| Foot Print |
Small space：
(W) 1200mm
×
(D) 860mm |
Small space：
(W) 1250mm
×
(D) 860mm
(chiller not included) |
Small space：
(W) 1200mm
×
(D) 860mm |
Small space：
(W) 1615mm
×
(D) 1000mm |
Small space：
(W) 1740mm
×
(D) 1000mm
(chiller not included) |
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| OTHERS |
・Total Sales of PCP Series： More than 1500 sets (As of April 2025)
・We can respond to your request flexibly.
・We can offer special price for the purchase of several sets together. |
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