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Our systems are used to probe the following devices.


 Type of Device
・ Discreet device
・ Transistor
・ CCD
・ LCD driver
・ SAW filter
・ Magnetic device
・ Power Management IC
・ MEMS
・ RF Device
・ Memory, etc.


 Material of Device
・ Wafer
・ Wafer level CSP (WL-CSP)
・ Rectangular package
・ Glass
・ Ceramic
・ FPC, etc.

 
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